ASH Solder Paste
Lead-Free | Halogen-Free | Leaded
The ASH solder paste is made by mixing high-quality spherical solder alloy powder and highly stable environmentally friendly solder paste. It features excellent continuous printing performance, wettability, low void rate, transparent residue, and high reliability welding effect. It is suitable for various precision electronic product fields such as smart communication products, smart home appliances, and new energy vehicles.
Lead-Free Solder Paste
Features
- Excellent Continuous Printability
- Superior Wettability
- Good Solder Climbing Ability
- Low Voiding Rates
- Transparent Residues
- Low-Halogen
Applications
- Home Appliances
- Network Communications Equipment
- Electrical Appliances
- Smartphones
- Modules
| Model | Alloy Composition | Powder Size | Viscosity (pa.s) | Melting Point (°C) |
|---|---|---|---|---|
| ASH SAC305 VXG | SnAg3.0Cu0.5 | 4#, 5#, 6# | 200±30 | 217-220 |
| GM2-980-VH | SnAg3.0Cu0.5 | 3#, 4#, 5# | 200±30 | 217-220 |
| GM2-980-VC | SnAg3.0Cu0.5 | 3#, 4# | 160±30 | 217-220 |
| AFM-980-V4 | SnAg3.0Cu0.5 | 3#, 4# | 200±30 | 217-220 |
| GM2-960-VH | SnAg1.0Cu0.5 | 3#, 4#, 5# | 200±30 | 217-227 |
| GM2-910-VH | SnAg0.3Cu0.7 | 3#, 4#, 5# | 200±30 | 217-227 |
Halogen-Free Solder Paste
Features
- Excellent Continuous Printability and Solder Deposition
- Superior Wettability
- Low Voiding Rates
- Transparent Residues
- Zero-Halogen Formulation
Applications
- Home Appliances
- Network Communications Equipment
- Electrical Appliances
- Smartphones
- Modules
| Model | Alloy Composition | Powder Size | Viscosity (pa.s) | Melting Point (°C) |
|---|---|---|---|---|
| ASH SAC305VHF | SnAg3.0Cu0.5 | 4#, 5#, 6# | 200±30 | 217-220 |
| GLH-980-VW | SnAg3.0Cu0.5 | 4#, 5#, 6# | 200±30 | 217-220 |
Leaded Solder Paste
Features
- Full and Bright Solder Joints
- Excellent Wettability
- Easy Soldering/Tinning
- High Reliability
Applications
- Home Appliances
- Network Communications
- Automotive Communications
- Military
- LED Products
| Model | Alloy Composition | Powder Size | Viscosity (pa.s) | Melting Point (°C) |
|---|---|---|---|---|
| GMR-404-VG | SnAg0.4Pb36.8 | 3#, 4# | 170±30 | 178-190 |
| GMR-470-VG | Sn63Pb37 | 3#, 4# | 200±30 | 183 |
Precautions for Use:
- Do not use for purposes other than soldering.
- Product storage conditions and shelf life: 6 months (0-10°C).
- When taking out from cold storage, avoid rapid temperature rise. Allow to return to room temperature (2-4 hours) in a sealed state before use.
- Before printing the solder paste, stir it with a manual or automatic mixer for 1-3 minutes.
- The working environment should be well-ventilated when using this product, and avoid inhaling its volatile odor.
- If chlorides or other solvents are mixed into the solder paste, the printing quality may deteriorate and solder balls may easily occur, so keep the stencil and tools particularly clean.
- After printing, please mount the components within 2 hours.
