ASH Flux

ASH fluxes mainly include lead-free flux series, halogen-free flux series, water-based flux series, photovoltaic module flux series, photovoltaic ribbon flux series, and wire flux series. The formula of ASH flux is specially designed with strong soldering and wetting properties. It can effectively remove oxide layers and undesirable substances that affect soldering, which is conducive to the formation of interfacial alloys and bright and full solder joints. Even printed circuit boards with general solderability and those treated with the OSP process can achieve good soldering results. It is especially suitable for lead-free processes.

Flux

Product Series Color/State Density (g/cm³) Solid Content (wt%) Surface Insulation Resistance (Ω) Product Features Product Applications
AS-700 Light Yellow Liquid 5.0±0.1 ≥1.0 x 10⁹ ≥1.0 x 10⁹ Low rosin, high activity, uniform tinning, good tin penetration, full solder joints, bright color. Applied to power products such as instruments, communication equipment, audio equipment, UPS, and household appliances.
AS-708 Light Yellow Liquid 0.81±0.01 5.0±0.1 ≥1.0 x 10⁹ Completely halogen-free, meets EU halogen-free requirements, low rosin, high activity, strong wetting force, good through-hole tin penetration, stable and reliable electrical performance after soldering. Applied to power products such as instruments, communication equipment, audio equipment, UPS, and household appliances.

Precautions for Use:

  1. Flux is packaged in plastic drums with a packaging specification of 20L/drum.
  2. Flux should be stored in a cool, dry, and well-ventilated place, avoiding direct sunlight.
  3. The shelf life is 6 months.
  4. It is strictly forbidden to mix with other types of flux or diluents.
  5. When used for closed spray soldering, it is not necessary to add a diluent. Spray cans and nozzles should be cleaned regularly.
  6. For dip soldering, the flux in the dip soldering tank should be drained and the tank cleaned after continuous use for one week.
  7. For severely oxidized circuit boards or lead pins, it is recommended to treat them before soldering.
  8. Adjust the amount of dipping liquid reasonably. The amount of dipping liquid should be such that the flux can be evenly distributed on the circuit board. Careful adjustment is especially important for IC sockets.
  9. Soldering and cleaning workstations should be ventilated.

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